C.C. Wei
CEO, TSMC (TSM) · Chairman & CEO, TSMC (TSM)
aka C. C. Wei, Wei
“N2 technology ramping successfully in high-volume manufacturing with good yield.”
“N3 gross margin to cross over to the corporate average in second half 2026.”
“Middle East situation may impact chemical and gas pricing.”
“our packaging capacity is so tight that now it's limiting my customers' growth. We welcome that additional flexibility in the market. That will help TSMC's front-end wafer business growth, which is a majority part of TSMC's business.”
“I also say that since our capacity in the back end is so in shortage mode, the gap is bigger. I welcome that the competitor offers some of the flexibility to my customer so that their front-end wafer can be put into the package, and that help TSMC's front-end wafer business. That's our attitude.”
“The emergence of agentic AI is leading to a resurgence in the role of CPUs in AI data centers, which drive more silicon demand in addition to AI accelerators. We believe this is positive for TSMC, as no matter what CPU approach is taken, whether it's a x86, Arm-based, or RISC-V architecture, they are almost all TSMC's customers.”
“With the strong collaboration and support from our leading U.S. customers and the U.S. federal, state, and city government, we would like to announce an additional $100 billion investment in Arizona. This is to build several more semiconductor logical wafer fab for 2 nm and below technologies, as well as advanced packaging fabs to support the strong multi-year demand from our leading U.S. customers.”
“Well, simply put, the most important reason is because of demand continue to increase, and we feel the pressure from the customer to drive TSMC, not drive actually, to cooperate with TSMC for the capacity increase. That's one of the major reason. The second reason is inflation. Now we buy the tools with inflation price.”
“Only the one which are related to AI is in shortage, which is the most important one, is the number one, is power management IC, because of all the AI data center need a lot of power management. Those are the mature node technology like 0.18 micron, 19 nm, or something like that. Those are in shortage, definitely. Also, the sensor portion... Other than that, other area, just like you pointed out, the consumer product is not in a high demand.”
“Looking ahead, we observe consumer and the price-sensitive end market segment are being challenged due to the impact of rising component prices and macroeconomic uncertainties.”
“No, we don't have a number to share. Let me say that the gap is very big. Sorry, I don't want to make a comment on the memory, a very big gap.”
“So far, no, TSMC don't do this kind of financial arrangement because of we think we are working with current customer with the current model smoothly and also successfully.”
“Now, remember that I believe every customer tell me the truth. Everyone. You put all the truths together, it's not the truth. We have to make some of the judgment... Actually, we are checking the AI data centers of progress, the building, the location, the demand, the rest. We checking all that to make sure that TSMC's chips will not be put in inventory.”
“Let me say that I believe from this day on all the way to probably 2029, 2030, the demand is very strong. Whether in between there's a dip or not, I'm not very sure. The trend is so robust that I believe we are witnessing a kind of a new industry.”
“Yes, I'm really jealous about memory companies, 86% gross margin. 86%? About 68%, I would be happy about that.”
“our packaging capacity is so tight that now it's limiting my customers' growth”
“We welcome that additional flexibility in the market. That will help TSMC's front-end wafer business growth, which is a majority part of TSMC's business.”
“The front end's wafer business and the back end's business are two different things, right? If they are the same, you can expect ASE become the front-end competitor also.”
“We believe this is positive for TSMC, as no matter what CPU approach is taken, whether it's a x86, Arm-based, or RISC-V architecture, they are almost all TSMC's customers.”
“we observe consumer and the price-sensitive end market segment are being challenged due to the impact of rising component prices and macroeconomic uncertainties”
C.C. Wei
One-line summary: CEO of TSMC; primary speaker on TSM Q1 2026 earnings call confirming N2 'good yield', Middle East gas/chemical risk, N3 margin crossover H2 2026, and tightness through 2027.
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Said
Speaker-attributed claims extracted from diarized sources. Each bullet mirrors one entry in quotes: frontmatter — keep them in sync.
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On (no topic linked):
"N2 technology ramping successfully in high-volume manufacturing with good yield." — 2026-04-16-earnings-tsm-q1-2026
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On (no topic linked):
"N3 gross margin to cross over to the corporate average in second half 2026." — 2026-04-16-earnings-tsm-q1-2026
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On (no topic linked):
"Middle East situation may impact chemical and gas pricing." — 2026-04-16-earnings-tsm-q1-2026
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On cowos-packaging-capacity-crunch, hbm-supply-bottleneck:
"our packaging capacity is so tight that now it's limiting my customers' growth. We welcome that additional flexibility in the market. That will help TSMC's front-end wafer business growth, which is a majority part of TSMC's business." — 2026-07-16-earnings-tsm-q2-fy2026 (2026-07-16)
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On cowos-packaging-capacity-crunch, picks-and-shovels-leading-edge-fab-buildout:
"I also say that since our capacity in the back end is so in shortage mode, the gap is bigger. I welcome that the competitor offers some of the flexibility to my customer so that their front-end wafer can be put into the package, and that help TSMC's front-end wafer business. That's our attitude." — 2026-07-16-earnings-tsm-q2-fy2026 (2026-07-16)
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"The emergence of agentic AI is leading to a resurgence in the role of CPUs in AI data centers, which drive more silicon demand in addition to AI accelerators. We believe this is positive for TSMC, as no matter what CPU approach is taken, whether it's a x86, Arm-based, or RISC-V architecture, they are almost all TSMC's customers." — 2026-07-16-earnings-tsm-q2-fy2026 (2026-07-16)
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On us-fab-capacity-bottleneck, picks-and-shovels-leading-edge-fab-buildout:
"With the strong collaboration and support from our leading U.S. customers and the U.S. federal, state, and city government, we would like to announce an additional $100 billion investment in Arizona. This is to build several more semiconductor logical wafer fab for 2 nm and below technologies, as well as advanced packaging fabs to support the strong multi-year demand from our leading U.S. customers." — 2026-07-16-earnings-tsm-q2-fy2026 (2026-07-16)
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On semicap-tool-price-inflation, picks-and-shovels-leading-edge-fab-buildout:
"Well, simply put, the most important reason is because of demand continue to increase, and we feel the pressure from the customer to drive TSMC, not drive actually, to cooperate with TSMC for the capacity increase. That's one of the major reason. The second reason is inflation. Now we buy the tools with inflation price." — 2026-07-16-earnings-tsm-q2-fy2026 (2026-07-16)
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On mature-node-ai-adjacent-shortage:
"Only the one which are related to AI is in shortage, which is the most important one, is the number one, is power management IC, because of all the AI data center need a lot of power management. Those are the mature node technology like 0.18 micron, 19 nm, or something like that. Those are in shortage, definitely. Also, the sensor portion... Other than that, other area, just like you pointed out, the consumer product is not in a high demand." — 2026-07-16-earnings-tsm-q2-fy2026 (2026-07-16)
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On hbm-cowos-as-binding-bottleneck, secondary-device-market-supply-constraint:
"Looking ahead, we observe consumer and the price-sensitive end market segment are being challenged due to the impact of rising component prices and macroeconomic uncertainties." — 2026-07-16-earnings-tsm-q2-fy2026 (2026-07-16)
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On tsmc-capacity-shortfall-and-pricing-power:
"No, we don't have a number to share. Let me say that the gap is very big. Sorry, I don't want to make a comment on the memory, a very big gap." — 2026-07-16-earnings-tsm-q2-fy2026 (2026-07-16)
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On nvidia-gpu-backstop-to-neocloud-financeability:
"So far, no, TSMC don't do this kind of financial arrangement because of we think we are working with current customer with the current model smoothly and also successfully." — 2026-07-16-earnings-tsm-q2-fy2026 (2026-07-16)
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On phantom-data-center-load, tsmc-capacity-shortfall-and-pricing-power:
"Now, remember that I believe every customer tell me the truth. Everyone. You put all the truths together, it's not the truth. We have to make some of the judgment... Actually, we are checking the AI data centers of progress, the building, the location, the demand, the rest. We checking all that to make sure that TSMC's chips will not be put in inventory." — 2026-07-16-earnings-tsm-q2-fy2026 (2026-07-16)
-
On tsmc-capacity-shortfall-and-pricing-power:
"Let me say that I believe from this day on all the way to probably 2029, 2030, the demand is very strong. Whether in between there's a dip or not, I'm not very sure. The trend is so robust that I believe we are witnessing a kind of a new industry." — 2026-07-16-earnings-tsm-q2-fy2026 (2026-07-16)
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"Yes, I'm really jealous about memory companies, 86% gross margin. 86%? About 68%, I would be happy about that." — 2026-07-16-earnings-tsm-q2-fy2026 (2026-07-16)
-
On cowos-packaging-capacity-crunch, packaging-scarcity-to-emib-t-second-source, hbm-cowos-as-binding-bottleneck:
"our packaging capacity is so tight that now it's limiting my customers' growth" — 2026-07-16-earnings-tsm-q2-fy2026 (2026-07-16)
-
On packaging-scarcity-to-emib-t-second-source, cowos-packaging-capacity-crunch:
"We welcome that additional flexibility in the market. That will help TSMC's front-end wafer business growth, which is a majority part of TSMC's business." — 2026-07-16-earnings-tsm-q2-fy2026 (2026-07-16)
-
On packaging-scarcity-to-emib-t-second-source:
"The front end's wafer business and the back end's business are two different things, right? If they are the same, you can expect ASE become the front-end competitor also." — 2026-07-16-earnings-tsm-q2-fy2026 (2026-07-16)
-
On agentic-ai-cpu-resurgence-to-tsm-silicon-broadening:
"We believe this is positive for TSMC, as no matter what CPU approach is taken, whether it's a x86, Arm-based, or RISC-V architecture, they are almost all TSMC's customers." — 2026-07-16-earnings-tsm-q2-fy2026 (2026-07-16)
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On memory-crowd-out-to-trade-in-funnel-scarcity, memory-shock-to-oem-value-transfer:
"we observe consumer and the price-sensitive end market segment are being challenged due to the impact of rising component prices and macroeconomic uncertainties" — 2026-07-16-earnings-tsm-q2-fy2026 (2026-07-16)
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